Blade dicing (dicing with blades) of ceramics is often used for semiconductor packages and electric circuit modules. HTCC (high-temperature co-fired ceramic) substrates are used for semiconductor package substrates, which require heat tolerance and reliability, such as power devices and high-luminance LEDs. LTCC (low-temperature co-fired ceramic) substrates are used in the high-frequency circuit module and radar circuit module, which require frequency properties.
For the equipment to process hard and difficult-to-process materials like ceramics, multiple wire saws, which use loose abrasives and steel wiring, are adopted. Because abrasive materials and oil are contained in the loose abrasives, oil-prevention treatment after processing is necessary.
Dicing saws (dicing equipment which uses blades) process the workpiece using diamond blades (synthetic diamond blades), and de-ionized water or city water is supplied during the process. Thus, oil-prevention treatment is not required.
In multiple wire saw processing, the amount of kerf loss (margin generated due to dicing) is often approx. 0.2 mm wide. However, when processing with a dicing saw, the amount of kerf loss can be reduced down to 0.1 mm or less by selecting the optimal blades.
With multiple wire saws, tool change operations are required because the rollers prepared for each dicing pitch need to be replaced depending on the desired pitch. However, with blade dicing (dicing with blades), the dicing pitch can be changed at will without size conversion, so it is optimal for multiple specification production.