DISCO’s precision processing technologies have been improved through processing a wide range of materials.
We would like to use our accumulated know-how to achieve the best solutions to confront further challenges.
DISCO – Always leading technological advances

materials and method

SOLUTION

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Silicon (Si) and Dicing Before Grinding (DBG) Process

Silicon (Si) and Dicing Before Grinding (DBG) Process

Silicon × DBG

Sapphire and Laser Lift-Off

Sapphire and Laser Lift-Off

Sapphire × LLO

Ceramics and Dicing Using Blades

Ceramics and Dicing Using Blades

Ceramics × Blade Dicing

Sealing Resin and Mold Resin with Grinding Using Wheels

Sealing Resin and Mold Resin with Grinding Using Wheels

Sealing Resin and Mold Resin × Grinding

Silicon (Si) and Dry Polishing Process

Silicon (Si) and Dry Polishing Process

Silicon × Dry Polishing

Lithium Niobate (LiNbO3, LN) and Grinding Pprocess

Lithium Niobate (LiNbO₃, LN) and Grinding Pprocess

Lithium Niobate × Grinding

Search from the processing materials

Seach from the processing method

If you require solutions for your processing issues,
please contact DISCO CORPORATION.

High-precision processing Kiru, Kezuru, Migaku