Dicing is a process for cutting and making grooves on board-type workpieces approx. 10 mm thick using dicing blades.
Dicing blades are abrasive blades that use synthetic diamond as the abrasive grit. The outer diameter of the dicing blade is approx. 50 mm and thickness is approx. 0.01 - 0.5 mm. There are various types of blades with different grit sizes, bond materials, and shapes.
Dicing is performed by pressing the dicing blade against a board-type workpiece while rotating the dicing blade at a high speed and inserting a groove in the shape of a line.
Water (city water or D.I. water) is applied to cool down the processed area and remove contamination during processing. It is possible to process the workpiece in a strip shape by cutting the workpiece at a fixed pitch. Then, the strip-shaped workpieces are processed into die by rotating the processing table 90 degrees. The equipment used for dicing is called a dicing saw because it cuts out the workpiece into the shape of dice.
Fully-automatic dicing equipment using blades
Automatic dicing equipment using blades
The dicing saws currently available have several automated functions. They primarily come equipped with an automatic cutting position recognition function and cleaning function, and it is possible to process the workpieces in cassettes.
This type of the equipment needs the operator to insert the workpiece. It adopts an automatic cutting position recognition function.
・Semiconductor wafers
・Semiconductor packages
・Various types of electric components and devices for optical device applications
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