We have experience (dicing, cutting, grooving, slicing, grinding, thinning, polishing, etc.) with the following materials. Please contact us for more details.

Ag(Silver)
Al(Aluminium)
AlN(Aluminum nitride)
Au(Gold)
Cu(Copper)
Diamond
GaAs(Gallium arsenide)
GaN(Gallium nitride)
GaP(Gallium Phosphide)
Ge(Germanium)
Glass
FR4(Flame Retardant type4)
Fused Silica
InP(Indium Phosphide)
LN(LiNbO3, Lithium niobate)
LT(LiTaO3, Lithium tantalate)
Mold Compounds
PCB(Printed Circuit Boards)
PZT(Pb(Zr,Ti)O3, Lead zirconate titanat)
QFN(Quad Flat No leaded package)
Resin
SiC(Silicon Carbide)
SiGe(Silicon Germanium)
SiN(Silicon Nitride)
SiO2(Quartz)
SUS(Stainless steel)
Tungsten(W)
WCu(copper tungsten alloy)
ZrO2(Zirconia)

Even if a material is not listed, please contact us.