DISCO Technology Advancing the Cutting Edge
by DISCO Corporation
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HOW
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Silicon
Sapphire
Ceramics
Gallium oxide
Sealing resin/Mold resin
Seach from the processing method
Dicing process using blades
Thinning by grinding wheel
Dicing by laser
Conventional process
Dicing Before Grinding(DBG)
Laser Lift-Off(LLO)
Inquiries and Consultation
Consultation for Free-of-Charge Processing
Online Processing Feasibility Confirmation
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Inquiries and Consultation
DISCO Technology Advancing the Cutting Edge
by DISCO Corporation
High-precision processing Kiru, Kezuru, Migaku
Search from the processing materials
Silicon
Sapphire
Ceramics
Gallium oxide
Sealing resin/Mold resin
Seach from the processing method
Dicing process using blades
Thinning by grinding wheel
Dicing by laser
Conventional process
Dicing Before Grinding(DBG)
Laser Lift-Off(LLO)
Inquiries and Consultation
Consultation for Free-of-Charge Processing
Online Processing Feasibility Confirmation