High-precision processing Kiru, Kezuru, Migaku

Search from the processing materials

Silicon
Sapphire
Ceramics
Gallium oxide
Sealing resin/Mold resin

Seach from the processing method

Dicing process using blades
Thinning by grinding wheel
Dicing by laser
Conventional process
Dicing Before Grinding(DBG)
Laser Lift-Off(LLO)

Inquiries and Consultation

Consultation for Free-of-Charge Processing

Online Processing Feasibility Confirmation